@inproceedings{ayoub:hal-04080577,
  TITLE = {{Sub 1 $\mu$m Pitch Achievement for Cu/SiO2 Hybrid Bonding}},
  AUTHOR = {Ayoub, Bassel and Lhostis, Sandrine and Moreau, Stephane and Souchier, Emeline and Deloffre, Emilie and Mermoz, Sebastien and Cacho, Maria Gabriela Gusmao and Szekely, Norah and Rey, Christelle and Aybeke, Ece and Gredy, Victor and Lamontagne, Patrick and Thomas, Olivier and Fremont, Helene},
  URL = {https://hal.science/hal-04080577},
  BOOKTITLE = {{2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)}},
  ADDRESS = {Singapour, Singapore},
  PUBLISHER = {{IEEE}},
  PAGES = {418-424},
  YEAR = {2022},
  MONTH = Dec,
  DOI = {10.1109/eptc56328.2022.10013180},
  KEYWORDS = {Thermomechanical processes ; Stability criteria ; Crystals ; Bonding processes ; Copper ; Crystal orientation ; Integrated circuit reliability ; Silicon compounds ; Thermomechanical treatment},
  HAL_ID = {hal-04080577},
  HAL_VERSION = {v1},
}